Principles and Diagrams of Wire Bonding Installation for Ceramic Capacitors

Article OverviewWire bonding is a semiconductor packaging technology that uses fine metal wires to connect the pins of a chip to a package or a printed circuit board (PCB) to achieve electrical signal transmission. This article will briefly explain the installation principles and diagrams of wire bonding.

What is wire bonding?

A customer bought the wrong ceramic capacitors. They bought ceramic capacitors that do not support reflow soldering and need to use epoxy resin to install the product on the PCB and require wire bonding for connection. So this post will explain what wire bonding is.

Wire bonding is a technology used to connect electronic components or chips to their packages or PCBs and is widely used in the semiconductor packaging process. Using very fine metal wires (such as gold, aluminum, or copper), the pads on the electronic components are connected to the pins on the package or substrate to achieve electrical signal transmission. Wire bonding is widely used in integrated circuits (IC), micro - electro - mechanical systems (MEMS), sensors, power devices, etc.

Structure of Ceramic Capacitors

The following are the diagrams of wire bonding installation and epoxy resin installation:

We can see that epoxy resin is used to install and connect the capacitor and the base, and wire bonding (gold) is used to achieve the electrical connection.

Almost all MLCC capacitors are installed on the PCB using the reflow soldering process. However, for some harsh environments and automotive - grade applications, another PCB installation method can be used: epoxy resin glue instead of welding "bonding". Epoxy resin glue is also divided into conductive and non - conductive. And wire bonding is another option.

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