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Detailed Summary of Wafer Fabs in Mainland China in 2024
Time：2024-12-31 【Original】
SMIC (Semiconductor Manufacturing International Corporation): Headquartered in Shanghai, SMIC owns multiple wafer fabs in the city, covering different technology nodes. It is a leading wafer foundry enterprise in China. Committed to providing integrated circuit wafer foundry and technology services, SMIC promotes the development of China's semiconductor industry. Hua Hong Semiconductor: It has built three 8 - inch wafer fabs in Jinqiao and Zhangjiang, Shanghai. It offers customizable process options for various technology nodes, including featured process technologies such as analog and power management. Hua Hong Semiconductor has profound technical accumulation and a rich product line in the semiconductor field. TSMC (Taiwan Semiconductor Manufacturing Company): TSMC has an 8 - inch wafer fab in Shanghai, which is one of its important production bases in the Chinese mainland. As a world - leading wafer foundry enterprise, the Shanghai plant also adheres to high - quality and high - efficiency production standards. GalaxyCore Semiconductor: It has a 12 - inch wafer fab in Lingang, Shanghai, focusing on the research, development, and industrialization of CIS (CMOS Image Sensor) integrated circuits. GalaxyCore Semiconductor has significant technical advantages and a strong market position in the image sensor field. Dingtai Jiangxin: It is China's [sensitive word] 12 - inch automotive - grade semiconductor wafer fab, focusing on the production of automotive - grade power devices. The establishment of Dingtai Jiangxin has further enhanced China's strength in the high - end semiconductor manufacturing field. Jita Semiconductor: Formerly known as Shanghai Philips Semiconductor Company, it was later absorbed and merged by Shanghai Jita Semiconductor Co., Ltd. Jita Semiconductor has an annual production capacity of 8 - inch equivalent wafers and is one of the important semiconductor manufacturing enterprises in China. Xinwei Semiconductor: It has foundry qualifications in the three application fields of radio - frequency, power, and optoelectronics. The second - phase project of Xinwei Semiconductor has been successfully implemented in the Lingang New Area of Shanghai, further expanding its production capacity. As a compound semiconductor wafer foundry enterprise, it provides high - quality compound semiconductor products for customers. Shanghai Advanced Semiconductor Manufacturing Co., Ltd.: Founded in 1988, this company is engaged in the manufacturing of computers, communications, and other electronic equipment. It has rich experience and technical strength in the semiconductor manufacturing field. Shanghai Xinjin Semiconductor Manufacturing Co., Ltd.: It has 5 - inch, 6 - inch, and 8 - inch wafer production lines, focusing on the manufacturing of analog circuits and power devices, and provides high - quality semiconductor products for customers. As a member of the semiconductor manufacturing industry, this company has a production base in Shanghai and is committed to the research, development, and production of semiconductor products.
CanSemi: Guangzhou CanSemi Technology Inc., founded in 2017 and located in Guangzhou, Guangdong Province, is a "National High - tech Enterprise" with local independent innovation in Guangdong Province. It is also a 12 - inch chip manufacturing enterprise in the Guangdong - Hong Kong - Macao Greater Bay Area that has fully entered mass production [1]. The chairman is Chen Jin. CanSemi is a local independent innovation enterprise in Guangdong Province and currently the [sensitive word] and [sensitive word] 12 - inch wafer manufacturing enterprise in the Guangdong - Hong Kong - Macao Greater Bay Area to enter mass production. The first - phase project of CanSemi started construction in March 2018, was completed and put into production in September 2019, and achieved full - capacity operation in December 2020. The second - phase project added a monthly production capacity of 20,000 wafers, and the technology node will be extended to the 55nm process. In November last year, Chen Wei once revealed that after the third and fourth phases are put into production, they strive to reach a monthly production capacity of 120,000 wafers by the end of 2025. Zengxin: Zengxin's project is the first domestic 12 - inch intelligent sensor wafer manufacturing production line. This project is located in the core area of Zengcheng Economic and Technological Development Zone. The first - phase investment is 7 billion yuan, and a 12 - inch MEMS manufacturing production line with a monthly processing capacity of 20,000 wafers is under construction. It is expected to deliver products to customers by the end of this year. Zengxin is the [sensitive word] chip - making enterprise to be established in Zengcheng. Its 12 - inch advanced intelligent sensor and featured - process wafer manufacturing production line project is a key project in Guangdong Province and Guangzhou City, and is of great significance to the development of the integrated circuit industry in Zengcheng, Guangzhou, and Guangdong.
Entering the main workshop access corridor of the Zengxin project, you can directly understand the chip - making production process. Chip - making has extremely high requirements for a clean environment. At the scene, reporters saw that wafer processing equipment including lithography machines and dry etching machines, as well as various inspection and testing equipment, were neatly arranged. The entire operation workshop was spotless, and the staff were operating while wearing clean suits. Currently, the clean - room area of the first - phase project reaches 16,000 square meters, and it is expected to achieve the target of a monthly production of 20,000 wafers by the end of 2025. Xinyueneng: The silicon carbide chip project of Xinyueneng is carried out in two phases. It is planned to build production lines for 240,000 6 - inch and 240,000 8 - inch silicon carbide chips per year. The annual output value of the first - phase project when reaching full production is 4 billion yuan, and the total annual output value after the second - phase project reaches full production will be 10 billion yuan, which will greatly alleviate the current shortage of domestic automotive - grade silicon carbide chips. Shao Yonghua, the director of the Xinyueneng wafer fab, previously revealed in an interview with the media that the factory is currently ramping up production capacity and is expected to achieve the planned production capacity of 240,000 6 - inch silicon carbide chips per year by the end of 2024. Xinjuneng: Located in Nansha District, Guangzhou, Xinjuneng mainly deals with silicon - carbide - based and silicon - based power semiconductor devices and modules, providing high - performance power semiconductor products for customers.
SMIC: Since 2022, the 12 - inch integrated circuit production line project of SMIC and the 12 - inch advanced - process integrated circuit production line of China Resources Micro in the Greater Bay Area have been included in "The Arrangement of Major Projects in Shenzhen in 2022". In March 2021, SMIC announced that it would invest in building a factory in Shenzhen. The construction period is from 2021 to 2025, and the project investment is about 2.35 billion US dollars (about 15.28 billion yuan). It aims to produce integrated circuits with a process of 28nm and above and provide technical services. It plans to achieve a monthly production capacity of 40,000 12 - inch wafers. However, the SMIC foundry in Shenzhen can only start mass production in the second half of 2022 at the earliest, and it cannot reach the monthly production capacity of 40,000 wafers in the initial stage.
The products of this project are positioned as 12 - inch display driver chips and power management chips with a line - width of 28nm and above. Tianyancha shows that the main shareholders of SMIC Integrated Circuit Manufacturing (Shenzhen) Co., Ltd. are Semiconductor Manufacturing International Corporation (holding 50% of the shares) and Shenzhen Major Industry Investment Group Co., Ltd. (holding 23% of the shares). China Resources Micro (Runpeng): This project plans to build a 12 - inch featured - process integrated circuit production line. The main shareholders are China Resources Micro (holding 75% of the shares), Shenzhen Bao'an Industrial Capital Operation Co., Ltd. (holding 10% of the shares), Shenzhen Major Industry Investment Group Co., Ltd. (holding 9% of the shares), and Shenzhen Guiding Fund Investment Co., Ltd. (holding 6% of the shares). Among them, China Resources Microelectronics (Hong Kong) Limited holds 75% of the equity of Runpeng Semiconductor through its wholly - owned subsidiary China Resources Micro Technology (Shenzhen) Co., Ltd.
It is understood that the total investment of the first phase of this project is 22 billion yuan, focusing on analog featured processes above 40 nanometers. After the project is completed, the products will be mainly applied to fields such as automotive electronics, new energy, industrial control, and consumer electronics. Shengweixu: Shengweixu, a DRAM manufacturer, is a 100% - owned enterprise of "Shenzhen State - owned Assets". Liu Xiaoqiang, the former director of TSMC, serves as the CEO of Shengweixu. It will enter the DRAM manufacturing business from the 28nm process. The planned total production capacity is 140,000 wafers per month. The first phase is under construction. It is planned to introduce machinery and equipment in the third quarter of next year and conduct trial production in the [sensitive word] quarter of 2024. It is located in Longhua District. Fangzheng Micro: In August 2021, Shenzhen state - owned assets officially took over Fangzheng Microelectronics. At that time, Fangzheng Microelectronics said that it would accelerate its development into a leading enterprise in the third - generation semiconductor chip manufacturing field and help Shenzhen build an innovation high - ground for third - generation semiconductors. It focuses on the manufacturing of power devices. Pengxinwei: Shenzhen Pengxinwei Integrated Circuit Manufacturing Co., Ltd. was founded in June 2021. It is committed to meeting the growing chip production capacity needs of markets such as automotive electronics, new energy, image sensing, smart homes, and wearable devices in the "Guangdong - Hong Kong - Macao Greater Bay Area", and provides integrated circuit wafer foundry and supporting services at the 28nm/20nm technology nodes for customers. According to Tianyancha, its actual controller is Shenzhen Major Industry Investment Group Co., Ltd. It is located in Pinghu Sub - district, Longgang District. Pengxinxu: Shenzhen Pengxinxu Technology Co., Ltd. (hereinafter referred to as "Pengxinxu") was founded in March 2022. Its actual controller is Shenzhen Shenchao Technology Investment Co., Ltd. (a wholly - owned subsidiary of Shenzhen Major Industry Investment Group Co., Ltd.). Pengxinxu focuses on the 40nm/28nm mature logic process and is a foundry factory. It is located in Pingshan District, next to SMIC Shenzhen. Shenai Semiconductor: Shenzhen Shenai Semiconductor Co., Ltd. was founded in 1988. It is a state - owned enterprise specialized in semiconductor power device chips and products within the SEG Group, a subsidiary of Shenzhen Investment Holding Co., Ltd., which is among the Fortune Global 500. It is a [sensitive word] "High - tech Enterprise". Currently, Shenai Semiconductor has the production capacity of various power semiconductor devices and has become a major enterprise in the domestic discrete device industry. The company currently has 5 - inch bipolar power chip production lines, 5 - inch MOS chip production lines, and 6 - inch MOS chip production lines. At the same time, the company's packaging lines have the large - scale production capacity of power devices in packaging forms such as TO series, SOT, SOP/DIP. The company address is Baolong Industrial Park, Longgang District, Shenzhen. Pengjin High - Tech: Founded in April 2022, it is a wholly - owned enterprise of the Chongtou Group. It is reported that the construction content of this project includes technological research on core equipment, components, and supporting materials for third - generation semiconductors and research on fourth - generation semiconductors, the opening of platforms for chip research and development and pilot - scale testing, and applications such as demonstration of electric drive for new - energy vehicles and rail transit. Innosec (Zhuhai): Innosec is a leader in the global power semiconductor revolution [2] and also the [sensitive word] gallium nitride chip manufacturing enterprise in the world. The company adopts the IDM (Integrated Device Manufacturer) full - industry - chain business model and has achieved the large - scale production of advanced 8 - inch gallium nitride for the first time globally. It is the leading enterprise in the global gallium nitride industry.
SK Hynix (Wuxi): SK Hynix is one of the world - leading semiconductor suppliers. Its factory in Wuxi is an important production base of the company. This factory focuses on the manufacturing of storage chips such as DRAM (Dynamic Random - Access Memory) and has advanced production technology and equipment. China Resources Microelectronics (Wuxi): China Resources Microelectronics is a leading semiconductor enterprise in China. Its Wuxi factory has strong R & D and production capabilities in the fields of power semiconductors and intelligent sensors. This factory is committed to promoting the self - control and high - quality development of China's semiconductor industry. Hua Hong Semiconductor (Wuxi): Hua Hong Semiconductor is one of the leading integrated circuit manufacturing enterprises in mainland China. Its factory in Wuxi is an important production base of the Hua Hong Group. This factory focuses on the research and development and manufacturing of featured - process integrated circuits, including embedded non - volatile memory, power devices, analog and mixed - signal circuits, etc. Infineon (Wuxi): Infineon is a world - leading semiconductor solution provider. It has a production base in Wuxi, focusing on the chip manufacturing in fields such as automotive electronics, industrial power control, smart cards, and security chips. TSMC Nanjing Plant: TSMC is the [sensitive word] semiconductor manufacturing company in the world. It has a production base in Nanjing. The TSMC Nanjing plant focuses on the manufacturing of wafers with advanced processes and provides high - quality chip products for domestic and foreign customers. The establishment of this plant has not only improved the manufacturing level of the semiconductor industry in Jiangsu but also further promoted the development of the entire industry. Hejian Chip (Suzhou): Hejian Chip is a Fab plant invested and built by UMC (United Microelectronics Corporation) of Taiwan in Suzhou, focusing on the manufacturing of integrated circuits. This plant has advanced manufacturing equipment and process technologies and can produce various types of chip products to meet the needs of different customers. Rongxin Semiconductor: Founded in April 2021 and headquartered in Ningbo, Zhejiang Province, China, it is an integrated circuit manufacturing enterprise committed to mature - process featured technologies. Rongxin Semiconductor has 12 - inch integrated circuit production lines in Huai'an, Jiangsu, and Ningbo, Zhejiang. It also has subsidiaries in Beijing, Shanghai, and other places. As an emerging foundry, Rongxin Semiconductor adheres to market - oriented continuous innovation and an efficient private - enterprise mechanism, focusing its products on image sensors, display drivers, power devices, power management, code - type flash memory, etc., emphasizing mature - process featured technologies and providing excellent technical development capabilities and 12 - inch wafer manufacturing production capacity for China's semiconductor industry. Innosec (Suzhou) Semiconductor Co., Ltd.: Founded in December 2015, Innosec is a high - tech company specialized in the research, development, and manufacturing of new third - generation semiconductor materials, devices, and integrated circuits. It has achieved the large - scale production of 8 - inch silicon - based gallium nitride materials and devices globally for the first time. It currently has more than 1,500 employees and has accumulated more than 700 patents worldwide. It has a R & D center and production base in Zhuhai, a management center and large - scale production base in Suzhou, an application R & D center in Shenzhen, and offices or representative offices in Nanjing, Chengdu, Shanghai, Beijing, Taiwan, Japan, South Korea, Europe, the United States, and other countries and regions. It aims to build a third - generation semiconductor production platform integrating R & D, design, epitaxial growth, chip manufacturing, testing, and failure analysis. Huaxin Jiechuang: Founded in August 2023, the foundry products of Huaxin Jiechuang include various chips. The Huai'an project is expected to have a total investment of up to 20 billion yuan, showing strong development momentum. Yangjie Technology: As one of the few outstanding IDM (Integrated Device Manufacturer) manufacturers with a vertically integrated semiconductor industry chain in China, Yangjie Technology has demonstrated excellent R & D and production capabilities in multiple fields.
Hangzhou Silan Microelectronics Co., Ltd.: As an integrated circuit design - and - manufacturing enterprise (IDM) in China, Silan Micro has advantages in wafer manufacturing. It has multiple chip production lines, including 5 - inch, 6 - inch, and 8 - inch production lines, and continues to invest in featured processes. Hangzhou Fuxin Semiconductor Co., Ltd.: As the first 12 - inch wafer production line project in Zhejiang, Fuxin Semiconductor has an important position in the high - end analog chip field. Its products are targeted at fields such as automotive electronics, artificial intelligence, and mobile digital products. Hangzhou Jihai Semiconductor Co., Ltd.: Headquartered in Qiantang District, Hangzhou, Jihai Semiconductor plans to launch a 12 - inch integrated circuit manufacturing project with a monthly production capacity of 20,000 wafers. The project will be built in two phases to meet the market demand for high - performance integrated circuits. Jiaxing Haixinwei Project: The total investment of this project is 10 billion yuan. It will build China's [sensitive word] 300 - millimeter production line with core and key processes for three - dimensional integrated circuit manufacturing. The success of this
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